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Spindle Growth Monitoring

CS26HF - CS27HF

The CS26HF monitoring system is focused on checking spindle growth, however it’s more generally used to detect variation in machine dimension mainly related to thermal effects.  

  • Stand alone system
  • Management of eddy-current sensor only
  • Spindle monitoring with the evaluation of thermal growth
Spindle Growth Monitoring
DESCRIPTION

CS26HF is a compact system that can be installed everywhere in the machine due to its IP67 high protection structure. The Eddy current sensor is directly connected to the CS26HF processing unit to eliminate any possible delays related to communication buses. Spindle growth monitoring is performed through the continuous checking of the signal generated by the eddy-current sensor and the information is forwarded to a PLC for possible compensation. Communication with a PLC is based on a simple, but reliable protocol designed for machine tools.

TECH SPECS
  • Monitors spindle growth and fluid thickness,
  • Connection to PC via USB
  • Connection to PLC
  • One sensor connectable
  • Visualization on Windows (CS150DG2 only)
VERSIONS

CS26HF: High performance application

CS27HF: Limited performance application

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Vibration Monitoring Details

CS150 - Vibration Monitoring
Tool Monitoring Details

CS2 - Tool Monitoring
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