Ingots Slicing Machine

The ingots are slowly lowered and cut into wafers for several hours during the sawing process. The trend is to use thinner diamond wires to minimize the cutting width and then get more wafers from a single ingot with significantly faster production speed. 

 If the diamond wire breaks during the ingot slicing process, it is crucial to stop the machine immediately. A Marposs acoustic sensor can be integrated inside the ingot-slicing machine to immediately stop the machine once it has detected the wire breakage, and then ease the following operation of wire replacement.