VBI: Revolutionizing Dicing Machines for Semiconductor Production - vbi-revolutionizing-dicing-machines-for-semiconductor-production
In the semiconductor industry, precision is paramount. The wafer dicing process, a critical step in chip production, demands exceptional accuracy to cut fragile materials like silicon, glass, sapphire, and advanced compounds such as silicon carbide (SiC) and gallium nitride (GaN). Even a minor defect during this phase can lead to significant production losses. Marposs has developed an innovative solution: the Visual Blade Inspector (VBI). This cutting-edge sensor technology redefines how dicing machines operate, ensuring higher precision and reliability.