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Hybrid contact/non-contact measurement with chromatic confocal technology

P3CF™

P3CF™  is a measuring system combining traditional contact probes and contactless probes relying on confocal technology (hybrid measurement). P3CF™ can directly measure both distance of all kind of materials and thickness of materials transparent to white light. 

Hybrid measurement with chromatic confocal technology
설명

Optimize your manufacturing process with P3CF™ technology, offering a cost-effective solution for thickness measurement even when material transparency is not guaranteed. Our innovative approach involves calculating thickness indirectly by determining the difference between the distances of a reference surface and the target on the same surface. P3CF™ can manage simultaneously up to four contact gauges and two non-contact confocal probes, enabling simultaneous thickness measurement on multi-axes machines performing both roughing and finishing processes. Such flexibility restricts the use of contactless tecnology to the final stage only of manufacturing process when it is not allowed to touch the target 

장점
  • Provides non-contact thickness measurement of any material transparent to white light 
  • Provides non-contact distance measurement, suitable in all cases where it is necessary to measure without touching the target 
  • Provides contact distance measurement, more reliable in the roughing stages or when targeting unpolished materials 
  • Provides hybrid measurement, carrying out combined contact and not contact measurement
  • Performs dynamic measurement with surfaces discontinuity management
  • Allows an easy integration into any system through SDK and protocol commands 
  • Allows a synchronized measurement with respect to axes position using encoders 
기술 사양
  • IP68 probes for measurement in harsh environement
  • IP40 probes for measurement in clean environment
  • Up to 4 contact probes and 2 contactless probes conntectable
  • Measure samples acquisition up to 2KHz 
  • Measuring SW available to combine in a multiple way single probes measurement 
  • Human-Machine-Interface avaialble for programming and measure acquisition from operator
  • Protocol command available for programming and measure acquisition from machine
버전
  • Contactless-only solution with 1 confocal probe
  • Contactless-only solution with 2 confocal probes
  • Hybrid-solution with 1 confocal probe and up to 2 UNIMAR probes
  • Hybrid-solution with 1 confocal probe and up to 4 UNIMAR probes
  • Hybrid-solution with 2 confocal probes and up to 2 UNIMAR probes
  • Hybrid-solution with 2 confocal probes and up to 4 UNIMAR probes
다운로드

BROCHURES AND MANUALS

전단
영어 P3CF: (1.43MB)
일본어 P3CF: (1.22MB)
한국어 P3CF: (1.43MB)
간체 중국어 P3CF: (664.33kB)

관련 애플리케이션

· 전자 산업 -- 컴퓨터, 소비자 전자 제품, 커뮤니케이션 세부내역

· 전자 산업 -- 컴퓨터, 소비자 전자 제품, 커뮤니케이션
· 전자 산업 -- 사무실 및 가정용 전자제품 세부내역

· 전자 산업 -- 사무실 및 가정용 전자제품
· 전자 산업 -- 실리콘 웨이퍼 세부내역

· 전자 산업 -- 실리콘 웨이퍼

마르포스는 기계가공 공정 간 및 최종 공장 환경에서 사용하기 위한 정밀 측정 장비를 전 세계에 공급하고 있습니다. 마르포스는 1980년부터 반도체 산업용 어플리케이션을 연구하고 판매하여 웨이퍼 제작 공정에서 신뢰성과 성능을 개선하는 데 깊이 관련된 OEM의 신뢰를...

Back end: wafer thinning 세부내역

Back Grinding: Wafer Thinning

박형 웨이퍼는 항상 섬세한 공정입니다. 접촉 게이지 또는 비접촉 센서를 사용하여 프로세스 내 박형화 작업을 엄격하게 제어할 수 있습니다.

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