VBI: Revolutionizing Dicing Machines for Semiconductor Production
In the semiconductor industry, precision is paramount. The wafer dicing process, a critical step in chip production, demands exceptional accuracy to cut fragile materials like silicon, glass, sapphire, and advanced compounds such as silicon carbide (SiC) and gallium nitride (GaN). Even a minor defect during this phase can lead to significant production losses. Marposs has developed an innovative solution: the Visual Blade Inspector (VBI). This cutting-edge sensor technology redefines how dicing machines operate, ensuring higher precision and reliability.
Challenges in Wafer Dicing
Dicing machines use ultra-thin blades made of diamond abrasives bonded to a core to achieve micrometric precision. These blades, operating at 30,000 to 60,000 RPM, are prone to wear, deformation, and breakage. Key challenges include:
- Backside Chipping: Often caused by blade imperfections, this results in damage to the wafer and reduced yield.
- Blade Integrity: Ensuring the blade is intact and defect-free is vital to achieving clean cuts.
- Shape and Wear Monitoring: Over time, blades may become oval-shaped or experience uneven wear, compromising cutting performance.
Operators must ensure that the blade's cutting edge remains in optimal condition while minimizing machine downtime. However, traditional methods of manual inspection are not only time- consuming but also prone to error.
The Marposs Solution: Visual Blade Inspector (VBI)
The VBI sensor addresses these challenges head-on by offering real-time, high-precision monitoring of the cutting blade. Its advanced optical and digital engineering provides unique advantages:
- Full Blade Monitoring: The VBI measures the entire extension of the blade’s cutting edge, detecting micrometric defects and deformations without halting operations.
- High-Speed Sampling: With a digitized optical sensor integrated into the measurement chain, the VBI transmits real-time data even as the blade rotates at high speeds.
- Comprehensive Blade Analysis: Beyond detecting defects, the sensor identifies shape irregularities and tracks wear patterns, ensuring consistent cutting quality.
- Ease of Integration: Designed for every types of blades, the VBI is versatile and easy to deploy across different dicing setups.
Transforming Semiconductor Production
Marposs's VBI sensor revolutionizes wafer dicing by combining real-time monitoring with advanced data processing. It ensures precise blade performance, minimizes defects like backside chipping, and reduces downtime through instant defect detection. By automating blade inspection and providing actionable insights, the VBI enhances cutting quality, improves efficiency, and supports smarter maintenance strategies, making it an indispensable tool for achieving higher yield and reliability in semiconductor production.
Why Choose Marposs?
With over 70 years of expertise in developing innovative solutions for manufacturing, Marposs continues to lead the way in precision engineering. From sensors for silicon ingot slicing to back- grinding machinery, our products are designed to enhance productivity and reliability. The VBI sensor exemplifies our commitment to helping customers achieve continuous improvement in their processes.
In the ever-evolving semiconductor industry, tools like the Visual Blade Inspector are essential for staying competitive. By providing real-time, precise monitoring of dicing blades, the VBI not only ensures superior cutting quality but also minimizes downtime and production losses. With the VBI, Marposs offers a concrete solution to the challenges of wafer dicing.