Sensor for dicing machines

Our Visual Blade Inspector (VBI) sensor, engineered to revolutionize wafer cutting operations, is designed for precision and reliability and continuously monitors blade performance during cutting, ensuring consistent quality and minimizing waste. With advanced sensor technology, it provides real-time measurement of blade wear and shape, reduces scrap, and seamlessly integrates into existing workflows.

The dicing process involves several fundamental aspects from the point of view of the sensor monitoring the blade.
The sensor checks the position of the blade (NCS) to ensure that it is aligned correctly with respect to the wafer, because incorrect positioning can cause defects in the chips. We are significantly faster than the competition while maintaining excellent repeatability.  During the process, the data collected by the sensor is analysed in real time to detect blade breakage (BBD), thus improving the quality of the cut and the overall efficiency of the process. The sensor also monitors the level of blade wear and can alert the operator or activate an automatic replacement system when the blade begins to wear. 

Our sensor is connected to an  electronic interface unit, which can handle two sensors at the same time: they can do the same function, or even two different functions.